Type | Clear Quartz Plate |
---|---|
Application | Semiconductor, Optical |
Thickness | 0.5-100mm |
Shape | Square |
Processing Service | Punching, Cutting |
Type | Clear Quartz Plate |
---|---|
Application | Semiconductor, Optical |
Thickness | 0.5-100mm |
Shape | Square |
Processing Service | Bending, Welding, Punching, Cutting, Polishing |
Material | SIO2 |
---|---|
Hardness | Morse 6.5 |
Working Temperature | 1200℃ |
Surface Quality | 20/40 Or 40/60 |
Dieletric Strength | 250~400Kv/cm |
Product Name | Precision Glass Machining |
---|---|
Material | SIO2 |
Hardness | Morse 6.5 |
Working Temperature | 1200℃ |
Surface Quality | 20/40 Or 40/60 |